PLANAR DOPE HEMT SEMICONDUCTOR WAFER AND PLANAR DOPE HEMT
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机译:平面掺杂HEMT半导体晶片和平面掺杂HEMT
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PROBLEM TO BE SOLVED: To increase the electron mobility of a two-dimensional electron gas in the case where metal organic vapor phase growth is used, to the same level as in the case where molecular beam epitaxy is used. ;SOLUTION: A channel layer is formed on a plane slightly inclined from a (100) plane of a GaAs substrate. An non-dope AlxGa1-xAs layer which is a first layer of a carrier supply layer is formed on the channel layer, and a high-density n-type planar dope layer which is a second layer of the supply layer is formed on the first layer. Then, a AlyGa1-yAs layer which is a third layer of the supply layer is formed on the second layer, thereby constituting a semiconductor wafer. In this case, the Al mixed crystal ratio x of the non- dope AlxGa1-xAs layer is set to 0.4 or greater. Using this semiconductor wafer, an HEMT is manufactured.;COPYRIGHT: (C)1997,JPO
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机译:解决的问题:在使用金属有机气相生长的情况下,将二维电子气的电子迁移率提高到与使用分子束外延的情况相同的水平。 ;解决方案:在相对于GaAs衬底的(100)平面稍微倾斜的平面上形成沟道层。在沟道层上形成非掺杂Al x Sub> Ga 1-x Sub> As层,其是载流子供应层的第一层,并且高密度n-在第一层上形成作为供给层的第二层的第二型平面掺杂层。然后,在第二层上形成作为供应层的第三层的Al y Sub> Ga 1-y Sub> As层,从而构成半导体晶片。在这种情况下,将非掺杂Al x Sub> Ga 1-x Sub> As层的Al混合晶体比x设置为0.4或更大。使用该半导体晶片,制造HEMT 。;版权所有:(C)1997,日本特许厅
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