PH adjusted microelectronic substrate cleaning, non-ionic surface active agent-containing alkaline cleaner composition

摘要

PURPOSE: To obtain an alkaline cleaner solution providing an effective wafer cleaning action without causing undue surface roughening of wafer by containing a basic aqueous solution of nonmetallic ions, a nonionic surfactant and an effective quantity of pH lowering chemical component for adjusting the pH of a cleaning liquid within a specified numerical range. ;CONSTITUTION: The alkaline cleaner composition contains a sufficient quantity of pH lowering chemical component for lowering or conditioning the pH of a basic aqueous solution of nonmetal ion, a nonionic surfactant and a cleaning liquid within a range of pH 8-pH 10. Consequently, an alkaline cleaner composition having action for cleaning a wafer effectively can be obtained without requiring hydrogen peroxide or other oxidizing agent and without causing undue surface roughening of wafer rejectable for fabrication and processing of IC, especially for fabrication of a high density IC.;COPYRIGHT: (C)1995,JPO