Method for forming material connections for absorbent products by soldering

摘要

The present invention relates to a process for providing connections of the materials making up disposable absorbent articles. In particular baby diapers, incontinence products and sanitary napkins which are fabricated in continuous processes are beneficially held together by soldering the materials were connections of them are desired. Replacing the currently used technique of adhesively attaching materials by soldering materials has the benefit of having non sticky surfaces once the solder is cooled to a temperature below its solidifying temperature. This is highly desirable where the otherwise sticky surface comes into contact with the skin of users of disposable absorbent articles or could cause adhesive build up on machine parts during the manufacturing of such articles. IMAGE