PROCEDURE FOR DEPOSITION OF CROMIUM NITRIDE COATING BY REACTIVE ION SPUTTERING

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  机译： 活性溅射装置和活性溅射方法以及活性蒸气沉积装置和活性蒸气沉积方法

• 4. Sputter deposition unit, useful for depositing titanium and titanium nitride coatings on semiconductor wafers, has a non-target material surface for receiving and re-sputtering target material onto a workpiece periphery [P] . 德国专利： DE10000019A1 . 2000-07-13

  机译： 溅射沉积单元可用于在半导体晶片上沉积钛和氮化钛涂层，其溅射靶具有非靶材表面，用于接收靶材并将靶材重新溅射到工件外围

• 5. Method for reactive sputter deposition and reactive sputter deposition system [P] . 日本专利： JP6244103B2 . 2017-12-06

  机译： 反应溅射沉积的方法和反应溅射沉积系统

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• 3. Correlation between Chemical Glass Components and the Glass Sticking on Sputtered PtIr Physical Vapour Deposition Coatings for Precision Blank Moulding [J] . Kirsten Bobzin ,Nazlim Bagcivan ,Tobias Brogelmann . 材料科学与应用期刊（英文） . 2014,第5期
• 4. Preparation and Corrosion Resistance of Magnesium Coatings by Magnetron Sputtering Deposition [J] . Hongwei HUO Ying LI and Fuhui WANGState Key Laboratory for Corrosion and Protection Institute of Metal Research Chinese Academy of Sciences Shenyang 110016 China . 材料科学技术：英文版 . 2003,第5期
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