Device with two micromachined substrates for forming a microsystem or part of a microsystem and assembly method for two micromachined substrates

摘要

A micro-system (30) such as a sensor consists of two substrates (32, 34), at least one of which can have electronic circuit elements, with a polymer layer (36) interleaved between the substrates. The polymer layer has at least one cavity (38) extending between the substrates and means to join the substrates by soldering in the cavities. The solder gives a mechanical joint resistant to tension between the substrates. Also claimed is the assembly process, which comprises: (a) providing a solder site on the first substrate; (b) putting a layer of photosensitive polymer on the surface of the second substrate and form in it the cavities; (c) forming solder sites in the centres thus formed; (d) applying the solder to the sites on one of the substrates; and (e) placing the substrates in contact through the solder and solder sites, and soldering.