The invention relates to a device comprising a first substrate and a second substrate intended to form a microsystem such as a sensor, at least one of the substrates may comprise electronic circuit elements. BR/ characterized in that a polymer layer is interposed between the first and second substrates, in that the polymer layer comprises at least one cavity extending from the first to the second substrate and in that the bonding means is are provided in the cavity, said welding means providing a mechanical linkage resistant to traction between the two substrates. / P
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