首页> 外文学位 >Compact modular assembly and packaging of multi-substrate microsystems (WIMS cube).
【24h】

Compact modular assembly and packaging of multi-substrate microsystems (WIMS cube).

机译:多基板微系统(WIMS cube)的紧凑模块化组装和包装。

获取原文
获取原文并翻译 | 示例

摘要

This research has developed a new approach for the assembly of microsystems consisting of multiple substrates containing circuits, sensors, and actuators in a reworkable and modular fashion. The microsystem dice are placed inside a cube (the WIMS -Wireless Integrated Microsystems- Cube). They are therefore self-aligned and stacked on top of one another, and are separated using non-conducting elastomer layers. Electrical/fluidic signal transfer between dice is achieved in one of two ways. The first method uses rows of integrated active flexible cables that are attached to the cube walls and actuated during assembly, row-by-row, to connect to the dice. The second method uses passive flexible cables integrated with separate connector dice that are interleaved between device dice inside the cube. In both methods, flexible cables make pressure contacts to microsystem dice, thus forming a mechanical connect/disconnect system for electrical/fluidic signals. A new actuation mechanism based on thermomagnetic effect was discovered and used for active flexible cables. In this actuation method, deflection caused by electromagnetic actuation can be increased by utilizing the softening of the cables due to heating. Thus, large deflections can be obtained at lower current levels. Thermomagnetically actuated 1mm x 1.3mm cables deflected 820-905mum with two stable positions in a 0.1T magnetic field and with a maximum power of 41.9mW.; The stress characterization of the deposited layers and optimization of the residual stress of the stack of layers were also conducted in order to achieve flexible cables with desired bending characteristics.; A process for forming a complete Cube with integrated electrical/fluidic connector cables and for assembling the entire microsystem was developed and WIMS Cube prototypes that are 5mm and 10mm on a side were fabricated using silicon technology to demonstrate the feasibility of this approach. The fabricated WIMS Cubes with integrated Parylene cables were tested for reliable pressure-contact electrical connections. Electrical contact resistances as low as 4.2O and 1.9O were achieved per passive electrical connectors and per two pressure-contact connections of active flexible cables, respectively. Reliability was demonstrated by electrically connecting and disconnecting the passive flexible cables ∼10 times. Tests on fluidic connectors were not performed.
机译:这项研究开发了一种新的微系统组装方法,该微系统由可重做和模块化的,包含电路,传感器和致动器的多个基板组成。微系统骰子放置在一个多维数据集中(WIMS-无线集成微系统-多维数据集)。因此,它们是自对准的并且彼此堆叠在一起,并且使用不导电的弹性体层将它们分开。骰子之间的电/流体信号传输以两种方式之一实现。第一种方法使用成排的集成有源软电缆,这些电缆连接到立方体壁,并在组装过程中逐行激活。第二种方法使用无源挠性电缆,该无源挠性电缆与单独的连接器管芯集成在一起,插入在立方体内部的设备管芯之间。在这两种方法中,柔性电缆都与微系统管芯形成压力接触,从而形成用于电/流体信号的机械连接/断开系统。发现了一种基于热磁效应的新型驱动机制,并将其用于有源柔性电缆。在这种致动方法中,可以通过利用由于加热引起的电缆的软化来增加由电磁致动引起的挠曲。因此,在较低的电流水平下可以获得较大的偏转。热磁驱动的1mm x 1.3mm电缆偏转820-905mum,在0.1T磁场中具有两个稳定位置,最大功率为41.9mW。为了获得具有所需弯曲特性的柔性电缆,还进行了沉积层的应力表征和层堆叠的残余应力的优化。开发了一种形成带有集成电气/流体连接器电缆的完整立方体并组装整个微系统的工艺,并使用硅技术制造了侧面5mm和10mm的WIMS Cube原型,以证明该方法的可行性。使用集成的聚对二甲苯电缆制造的WIMS立方体经过了可靠的压力接触式电气连接测试。每个无源电气连接器和有源柔性电缆的两个压力接触连接分别实现低至4.2O和1.9O的电接触电阻。通过电气连接和断开无源软电缆约10次来证明其可靠性。没有在流体连接器上进行测试。

著录项

  • 作者

    Ucok, Asli Burcu.;

  • 作者单位

    University of Michigan.;

  • 授予单位 University of Michigan.;
  • 学科 Engineering Electronics and Electrical.; Engineering Packaging.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 195 p.
  • 总页数 195
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;包装工程;
  • 关键词

  • 入库时间 2022-08-17 11:39:36

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号