An oxide film removing device for a copper lead frame surface and an oxide film removing method using the same

摘要

The present invention relates to a heat source device having a plurality of first injection holes and a plurality of first injection holes for preventing the surface of a copper lead frame from being oxidized, a heat shield, a plurality of second injection holes, Wherein the oxidizing film removing device and the lead frame transferred along the guide rail are transferred to the inside of the heat source generating device, The mixed gas injected into the injection port is heated and injected onto the surface of the lead frame through the first injection hole, then passed along the guide rail along the guide rail, and then transferred to the inside of the molding machine, A cold inert gas mixture injected into the injection port is injected onto the surface of the conveyed lead frame through the second injection hole of the folding device, By providing a removing method, and at the same time to remove the oxide film has the effect of creating a nitride film can be prevented from being re-oxidized.