Tin (Sn) -zinc (Zn) -bismuth (Bi) -antimony (Sb) alloys for solder without lead (Pb)

摘要

When soldering electrical and electronic copper and copper alloy parts, solder containing 40 to 70 wt% (wt%) of lead (Pb) is still widely used, and in recent years, pollution caused by lead (Pb) component The problem is seriously pointed out.;In view of this, the present invention develops a new soldering alloy that does not contain lead (Pb), thereby preventing pollution by fundamentally blocking the discharge of lead (Pb), which is a heavy metal, and specially providing a dust collecting facility of lead (Pb). It is intended to contribute to making it unnecessary to consider.;In the new soldering alloy of the present invention, the focus is on the soldering temperature, the soldering speed, the viscosity of the soldering material in the molten state, the wettability with the soldering material, the gloss after the soldering, and the like, compared with the conventional solder (Pb) soldering material. It is in the point that there is no inferiority.;On the other hand, the new brazing alloy of the present invention alloys tin (Sn) and zinc (Zn) at a ratio of about 10 to 1, and has a melting point of 200 ° C on a tin (Sn) -zinc (Zn) binary alloy state diagram. It was set as the lowest low melting process alloy of degree. Bismuth (Bi) and antimony (Sb) were alloyed in the range of 0.1 to 3.0 wt% (weight percent), respectively, in consideration of the soldering characteristics such as viscosity, wettability, solidification rate, and gloss after solidification.