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Solderless prevention device when soldering chip on printed circuit board automatically

机译:自动将芯片焊接在印刷电路板上的防焊装置

摘要

One The technical field of the invention recorded within the scope of the request;The invention forms the gas generated when the automatic welding is fair on the engine printed circuit board of the chip, and the gas hole is formed in the chip, so as to avoid the engine defect of the chip.;Two Technical issues to be solved in invention;In order to prevent the occurrence of automatic welding part, gas holes are respectively formed between the pattern sections formed on the printed circuit board, and the printed circuit board with automatic welding is provided on the printed circuit board.;Three The solution of the invention is important;The invention relates to a printed circuit board (1) whose image (2) is a conductive circuit (5) and a printed circuit board of the chip (4) when the shortened chip (4) is used as the abbreviationOn the left and right sides of the grid, they are separated by a distance to form the opposite direction,In chess Park (2), the gas of chemical gas generated during automatic welding is formed respectively.;Four Important uses of the invention;The invention prevents the automatic welding part on the printed circuit board from the pattern up and down formed on the printed circuit board,The gas hole is formed between the left and right parks. When automatic welding is carried out, the elastic gas of chemicals is discharged through the gas cylinder. The engine of printed circuit belt and chip will not improve the welding quality due to non payment.In addition, it is not necessary for the staff to retrieve the effect of welding of the unpaid part.
机译:一个本发明的技术领域记录在请求的范围内;本发明在芯片的引擎印刷电路板上形成自动焊接公平时产生的气体,并在芯片上形成气孔,从而避免芯片的引擎缺陷。本发明要解决的两个技术问题;为了防止发生自动焊接部分,在形成于印刷电路板上的图案部分与印刷电路板之间分别形成气孔。在本发明的解决方案中很重要;本发明涉及一种印刷电路板(1),其图像(2)是导电电路(5),以及一种印刷电路板。当使用缩短的筹码(4)作为缩写时的筹码(4)在网格的左侧和右侧,它们隔开一定距离以形成相反的方向,在国际象棋公园(2)中,化学气体产生的持续时间;本发明的四个重要用途;本发明防止了印刷电路板上的自动焊接部分形成在印刷电路板上的上下图案,在左右之间形成了气孔。公园。当进行自动焊接时,化学弹性气体通过气瓶排出。印刷电路带和芯片的引擎由于不付款而不会提高焊接质量,此外,员工没有必要找回未付款部分的焊接效果。

著录项

  • 公开/公告号KR970004989A

    专利类型

  • 公开/公告日1997-01-29

    原文格式PDF

  • 申请/专利权人 대표이사 김광호;

    申请/专利号KR19950015392

  • 发明设计人 이상홍;

    申请日1995-06-12

  • 分类号H05K3/34;

  • 国家 KR

  • 入库时间 2022-08-22 03:18:30

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