How to saw the wafer

摘要

When the conventional adhesive tape is bonded to one side of both sides of the wafer and the wafer is sawed while the ultraviolet-sensitive adhesive tape is bonded to the other side, the ultraviolet-sensitive adhesive tape is used as a buffer to blade the diamond cutter. By not stressing the wafer, defects such as chipping or micro cracks do not occur in the wafer.