PROBLEM TO BE SOLVED: To provide a single wafer cleaning system in which a vacuum chuck is provided on a cleaning bath on which the back face of a wafer whose mirror face to be cleaned faces downward is vacuumed and fixed, a cleaning solution supply pipe is attached to the cleaning bath, and a cleaning solution is supplied and agitated, thereby suppressing occurrence of particles and performing uniform cleaning. ;SOLUTION: A vacuum chuck 9 is arranged in the upper part of a central axis H passing the center O of a cylindrical inner cleaning vessel 2 whose bottom 2a is gently inclined toward the center. The back face 8b of a semiconductor wafer 8 whose mirror face is directed downward is evacuated and fixed on the end 9a of the vacuum chuck 9. A cleaning solution supply pipe 4 having nozzles 4a and 4b is attached so that the nozzles 4a and 4b are symmetrical with respect to the right and left by using the center O of the circular bottom 2a of the inner cleaning vessel 2 as a center. A cleaning solution W is supplied into the inner cleaning vessel 2 and is agitated. The mirror face of the semiconductor wafer 8 is cleaned with the agitated cleaning solution W.;COPYRIGHT: (C)1998,JPO
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