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Thin film formation manner and thin film formation thermal treatment equipment

机译:薄膜形成方式及薄膜形成热处理设备

摘要

PURPOSE:To improve quality of thin film by using plural heat-treating rooms to perform thin film formation containing purification of base plate and individually controlling temperature of raw material gas supplying to each heat-treating room. CONSTITUTION:A base plate 18 is washed in air and set on a base plate-fixing base 17 in a base plate-changing room 11 filled with inert gas such as N2. Next, the base plate is transferred to first heat-treating room 1 to remove naturally oxidized film on the surface of the base plate and subjected to pre-treatment, then oxidized by heat in O2 atmosphere. Thereafter, the first heat-treating room 1, connecting part 7 and the base plate-changing room 11 are made in inert gas atmosphere and the base plate 18 is returned to the base plate-changing room 11. Next, the first heat- treating room 1 is separated to the connecting part 7 and the connecting part 7 is connected to second heat-treating room 2. Then, the base plate 18 is transferred to the second heat-treating room 2, thus raw material gas such as silane or dopant such as phosphine is introduced into the second heat-treating room 2 with individually controlling concentration and flowing rate using temperature-controlling gas-supplying system 4 to accumulate gate electrode film. Thereafter, the base plate 18 is returned to the base plate-changing room 11.
机译:目的:通过使用多个热处理室进行薄膜形成(包括净化基板)并分别控制向每个热处理室供应的原料气体的温度,以提高薄膜质量。组成:基板18在空气中洗涤,并放置在基板更换室11的基板固定底座17上,该更换室11充满了惰性气体,例如N2。接下来,将基板转移到第一热处理室1中,以去除基板表面上的自然氧化膜并进行预处理,然后在O 2气氛中通过加热将其氧化。此后,在惰性气体气氛中形成第一热处理室1,连接部7和基板更换室11,并将基板18返回到基板更换室11。接下来,进行第一热处理。室1与连接部7分离,连接部7与第二热处理室2连接。然后,将基板18转移到第二热处理室2,从而产生硅烷或掺杂剂等原料气体。使用温度控制气体供应系统4,通过单独控制浓度和流速将诸如磷化氢之类的磷化氢引入第二热处理室2,以累积栅电极膜。之后,基板18返回到基板更换室11。

著录项

  • 公开/公告号JP2809450B2

    专利类型

  • 公开/公告日1998-10-08

    原文格式PDF

  • 申请/专利权人 NIPPON DENSHIN DENWA KK;

    申请/专利号JP19890288479

  • 发明设计人 YAMADA HIROSHI;

    申请日1989-11-06

  • 分类号C30B25/16;H01L21/205;

  • 国家 JP

  • 入库时间 2022-08-22 03:01:22

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