Improved interface between titanium and aluminum alloy in metal stack for integrated circuit

• 1. 在用于集成电路的金属堆栈中钛和铝合金之间的改进界面 [P] . 中国专利： CN1202273A . 1998-12-16
• 2. 减小集成电路(IC)的互连层中形成的金属线的端部部分之间的尖端到尖端距离 [P] . 中国专利： CN110192271A . 2019-08-30
• 3. Improved interface between titanium and aluminum alloys in metal stacks for integrated circuits [P] . 韩国专利： KR19990063873A . 1999-07-26

  机译： 集成电路金属堆叠中钛和铝合金之间的改进界面

• 4. IMPROVED INTERFACE BETWEEN TITANIUM AND ALUMINUM-ALLOY IN METAL STACK FOR INTEGRATED CIRCUIT [P] . 欧洲知识产权局专利： EP1008172A4 . 2000-06-14

  机译： 集成电路中金属层中钛与铝合金之间的界面改善

• 5. IMPROVED INTERFACE BETWEEN TITANIUM AND ALUMINUM-ALLOY IN METAL STACK FOR INTEGRATED CIRCUIT [P] . 欧洲知识产权局专利： EP1008172A1 . 2000-06-14

  机译： 集成电路中金属层中钛与铝合金之间的界面改善

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