首页>
外国专利>
Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof
Solder alloy or tin contact bump structure for unencapsulated microcircuits as well as a process for the production thereof
展开▼
机译:用于未封装微电路的焊料合金或锡接触凸点结构及其生产方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
The invention relates to a solder or tin contact bump structure and a method for the production thereof for unencapsulated microcircuits (15) comprising a substrate (15), contact pad areas (3) of aluminium formed on said substrate (15), a composite metal structure formed on the contact pad areas (3), formed of a TiW layer (7), an Au layer (4) formed thereon, and an Ni layer (5) formed on said Au layer, and a solder contact bump (6) formed on the composite metal structure (7, 4, 5). According to the invention the TiW layer (7) is sputtered in the presence of nitrogen and argon in connection with the layering, whereafter it is subject to oxygen treatment, and the Au layer (4) is formed by one deposition process only.
展开▼