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INTEGRATED SILICON VACUUM MICROPACKAGE FOR INFRARED DEVICES
INTEGRATED SILICON VACUUM MICROPACKAGE FOR INFRARED DEVICES
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机译:用于红外设备的集成硅真空微包装
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摘要
An efficient method brings together two wafers of dies that contain an infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasound bonding can be used.
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