INTEGRATED SILICON VACUUM MICROPACKAGE FOR INFRARED DEVICES

摘要

An efficient method brings together two wafers of dies that contain infrared transparent window or top cap with either an infrareddetector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between thewafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasound bonding can be used.