Chip size package (CSP) type semiconductor chip package

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip size package (CSP) type semiconductor chip package and a method of manufacturing the same. More particularly, the present invention provides a semiconductor chip package by changing a structure of a lead frame connecting a circuit pattern formed on a semiconductor chip with a predetermined external circuit. A semiconductor chip package of the CSP type, which has a thin and small size, comprising: a semiconductor chip having a lead frame, a bonding pad mounted on the lead frame, a conductive wire connecting the bonding pad and the lead of the lead frame; A semiconductor chip package comprising a molding resin for molding the whole, wherein the lead frame includes an inner lead attached to the semiconductor chip, and an outer lead having a protrusion having a predetermined height extending to the inner lead and electrically contacting the outside. It is characterized by.