PCB turn guide for back and auto inspection system for BGA semiconductor package

摘要

The present invention relates to a PCB turn guide for a back and auto inspection system for a BGA semiconductor package, in which a PCB 90 to which a solder ball 91 is fused during the manufacturing process of a BGA semiconductor package is removed from a deflux device 20 And an inspection device (40) for inspecting the presence or absence of the solder ball (91), the position and the ball size, and the like,;A turn guide 70 for placing the PCB 90 in a vertical position on the base 50A of the PCB ejection apparatus 50;;A groove 70A on which the PCB 90 is placed on the turn guide 70;;A process tool 71 for fixing both side surfaces of the PCB 90 placed in the groove 70A;;A cylinder (72) capable of expanding and contracting the fixture (71) left and right;;Thereby facilitating the feeding and feeding of the inspected PCB.