semiconductor device with multilayer lead frame (MULTI - LAYER LEAD FRAME free on rail, a SEMICONDUCTOR DEVICE)

摘要

the semiconductor die (10) for the separation of the multiple lead frame (20) is one of the first overlay (25, 40) and the second lead frame (40) and the relationship between distribution of insulator (55), each entity (25, 40) extend from at least one message the spring finger (35, 50) includes. the host (25, 40) of the die (10) for separation of the capacitor as a function of. one of the body, the finger is connected to a wire (10) and a coupling for connection to a power supply and ground connections for the body part, and the other is a (10) and a wire coupling for power and ground connections to other ubd80uc911 i provide.the first body (25) of the support (10) for a blade (30), including a second body (40) has a blade (30), including a second body (40) has a blade (30) and a plate (45) arranged between the insulator (55) with the blade (30), the plate (45) overlap, the include and the grounding connection part, and to provide, in between the electrical isolation effect, and to provide.