Film packaging device for artistic design

• 1. 用于薄膜包装的挤压装置、薄膜包装以及由挤压装置和薄膜包装构成的组件 [P] . 中国专利： CN108472681A . 2018-08-31
• 2. 用于纵向焊接和切断热塑性塑料薄膜包装管,特别是用于软管袋包装机的装置 [P] . 中国专利： CN1116981C . 2003.08.06
• 3. Procedure and device for handling flat and/or film materials designed for packaging articles [P] . 德国专利： DE102018131992A1 . 2020.06.18
• 4. METHOD FOR PUNCHING CATCH POINT IN PACKAGING MADE OF HEAT SEALED PLASTIC FILM AND DEVICE DESIGNED TO PUNCH CATCH POINT [P] . PL360815A1 . 2004-12-27

  机译： 在热封塑料薄膜包装中打孔的方法及设计用于打孔的设备

• 5. deaeration device of the product and placed under vacuum of packaging bags in the atmosphere 27 designed and filled with a vertical bagger automatically from a reel or a film [P] . 法国专利： FR2774657B1 . 2000-04-21

  机译： 产品的脱气装置，并置于包装袋中的真空中，在大气中27从卷轴或薄膜自动设计并填充垂直装袋机

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• 3. Design, fabrication and testing of conformal, localized wafer-level packaging for RF MEMS devices. [D] . Collins, Gustina B. 2006
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• 5. Fabrication and Doping of Freestanding Si-O-C Composite Films by Precursor Method and Their Application in LED Devices Packaging [O] . 毛宇 2016

• 1. The effect ofγ-ray irradiation on the SOT magnetic films and Hall devices [J] . Tengzhi Yang ,Yan Cui ,Yanru Li . 半导体学报：英文版 . 2021,第2期
• 2. Effect of Organic Dopants in Dimetallophthalocyanine Thin Films: Application to Optoelectronic Devices [J] . María Elena Sánchez-Vergara ,Santiago Osorio-Lefler ,Pablo Osorio-Lefler . 材料物理与化学进展（英文） . 2019,第4期
• 3. The Effect of Tin on PECVD-Deposited Germanium Sulfide Thin Films for Resistive RAM Devices [J] . Rene Rodriguez ,Benjamin Poulter ,Mateo Gonzalez . 材料科学与应用期刊（英文） . 2017,第2期
• 4. Ferroelectric Thin Films for Room Temperature Tunable Microwave Devices--The Current Status and Future [J] . 无 . 四川大学学报：自然科学版 . 2005,第0S1期
• 5. 景观小品灯光装置艺术设计初探 [C] . Yang Peiliang ,阳佩良 ,Yang Chunyu . 2017年四直辖市照明科技论坛 . 2017
• 6. 七巧板运用于艺术设计基础教学的研究 [A] . 高民 . 2009