Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same

摘要

A lead-on-chip package manufacturing method includes an insulating liquid adhesive depositing step on lead attaching regions formed on an active surface of a semiconductor on a wafer. The adhesive deposition may be accomplished by a screen printing method in which the adhesive is forced through hole patterns of a metal screen, or by a dispensing method in which a liquid adhesive is dispensed from needles of a dispensing head that is movable over the wafer surface and is aligned with the wafer. The dispensing technique may be applied to a plurality of chips in step-by- step fashion, or in a simultaneous manner by using a multi-needled dispensing head.