METHOD FOR FORMING AND MOUNTING SOLDER BUMP, AND SOLDER JUNCTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a solder bump together with a method for mounting a solder bump of high junction reliability. ;SOLUTION: A solder ball 15 is solder-jointed to a circuit electrode 12 through a through hole 13 provided at an insulating substrate 11, so that a solder bump is formed on the surface opposite to the circuit electrode 12 of the insulating substrate 11, related to a method for forming a solder bump. Here, the solder ball 15 is mounted on the through hole 13 provided as a diameter smaller than the solder ball 15, and the solder ball 15 is pressurized against the substrate 11 so that the upper end surface of the through hole 13 is crushed for beveling. Then the insulating substrate 11 is heated to melt the solder ball 15, for solder joint to the circuit electrode 12. Thus, a notch in the solder joint part is eliminated for preventing concentration of stress, thus reliability at the solder junction after mounting is improved.;COPYRIGHT: (C)1999,JPO