APPARATUS FOR FORMING A SOLDER BUMP CAPABLE OF PREVENTING SOLDER BALL MOUNTING FAILURE AND A METHOD FOR FORMING A SOLDER BUMP USING THE SAME

摘要

PURPOSE: An apparatus for forming a solder bump and a method for forming a solder bump using the same are provided to reduce the consumption of a wasted ball by mounting a solder ball through a ball head which repetitively performs vacuum processing and vacuum releasing.;CONSTITUTION: A ball head is formed in a body. A conductive ball is mounted on the ball head. A vacuum source(310) controls vacuum in the ball head. The ball head drops the conductive ball mounted inside by the vacuum control of the vacuum source. The ball head inhales a dropped conductive ball. A mask, on which a through hole is formed, is further included to be corresponded to a conductive ball mounted area.;COPYRIGHT KIPO 2012