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Electrode formation manner null of metal paste and ceramic electronic parts for base metal plated foundation activity
Electrode formation manner null of metal paste and ceramic electronic parts for base metal plated foundation activity
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机译:金属糊和陶瓷电子零件的电极形成方式对贱金属镀层底活性的影响。
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摘要
PURPOSE:To obtain a paste for which reactivation process is unnecessary by having 30 to 85 weight part of a material containing 99.9 to 80 weight part of Zn components and 0.1 to 20 weight part of one or more species among Ti, Al or Mg, dispersed as a metal component to a vehicle. CONSTITUTION:30 to 85 weight part of a metallic varnish for which a metallic material that contains 99.9 to 80 weight part of Zn components and 0.1 to 20 weight part of one or more species among Ti, Al or Mg, making the total 100 weight part thereof is dispersed in a solution, is dispersed as a metallic component to a vehicle that is composed of one or more materials among an oil-soluble resin, a water-soluble resin, or an oil- and water-soluble resin. Thereby, such a paste can be obtained as contributable not only to non-requirement of an activating process using precious metal unnecessary, but also to passibility of partial plating with base metals thus leading to cost reduction. Also, an electrode formed by electroless plating after the paste is baked on a dielectric ceramic substrate excels in its tensile strength.
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