Production manner null of copper metalization paste, and ceramic substrate for electronic circuit

摘要

PURPOSE:To decompose and disperse organic components in a paste effectively during binder removing process by adding a carbonate compound to the paste. CONSTITUTION:A copper-metalizing paste contains a carbonate compound or a copper carbonate as a part of the whole of a copper component. As the carbonate compound added to the copper-metalizing paste, CaCO3, MgCO3, SrCO3, NaCO3, CoCO3, Li2CO3, BaCO3, and FeCO3 are able to be used. If a carbonate compound is added to the copper-metalizing paste, CO2 gas is released from the carbonate compound near at binder removing temperature and due to the released CO2 gas, channels to disperse the binder components are formed in the metalizing paste and a green sheet and the binder components, are thus dispersed through the channels. Also, in the presence of the CO2, carbon components remaining in the metalizing paste and the green sheet convert remaining carbons into a gas and disperse it.