The major trends in miniaturization of the electronic components, devices, and systems have primarily led to a continuous increase in the capacitance value of multilayer ceramic capacitors (MLCCs). The objective is to achieve this without increasing the case size or the dimensions of the MLCC chip. This mandates the ceramic capacitor manufacturers to decrease the thickness of the barium titanate dielectric layer as well as the nickel base metal electrode layer thickness for base metal based MLCC capacitor (BME). The recent trend is also towards decreasing the fired copper termination dimensions of the BME MLCCs. The densification of the paste during drying depends on the interaction of resin with inorganic (glass, copper powder and flake) but during firing it depends on interaction of glass with copper. The present paper covers the effect of glass on densification of copper end termination. Glass chemistry also affects dissolution of termination in plating bath, which affects the plating bath yield as well as reliability of the capacitor. We will discuss the effect of glass on the acid durability of fired termination paste and reliability of the fired termination with different glass system. The effect of glass on the quality of termination interface development will also be discussed. The salient microstructural features of the copper termination obtained after firing the newly developed paste formulations at different temperatures will also be presented.
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