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Investigation of thin film end-termination on multilayer ceramic capacitors with base-metal-electrode

机译:具有贱金属电极的多层陶瓷电容器的薄膜端接研究

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The thin film of copper, chromium and titanium as end-termi nation studies were performed on multilayer ceramic capacitors (MLCCs) based on BaTiO_3 ceramic with nickel internal electrodes. A green sheet was prepared by tape casting using the X7R/BME powders. Nickel paste was attached to the green sheet as an internal electrode. After lamination, the green chips were sintered at 1300 deg C for 2 h, then the external electrodes were sputtered as thin films for end-termination. There is no extra curing process, so that thermal shock of the MLCCs is reduced. To improve the adhesion between thin film end-termination and dielectric body, chromium and titanium were applied as media in this study. The mechanical and electrical properties of the MLCCs were investigated subsequently. The results showed that end-termination with chromium/copper has good performances on electrical and mechanical properties of MLCC, compared to conventional end-termination.
机译:在基于带有镍内电极的BaTiO_3陶瓷的多层陶瓷电容器(MLCC)上进行了铜,铬和钛薄膜的最终研究。使用X7R / BME粉通过流延法制备生片。镍糊附着在生片上作为内部电极。层压后,将生芯片在1300摄氏度下烧结2小时,然后将外部电极溅射成薄膜以进行端接。没有额外的固化过程,因此可以降低MLCC的热冲击。为了提高薄膜末端与电介质体之间的粘附力,本研究采用铬和钛作为介质。随后研究了MLCC的机械和电气性能。结果表明,与常规的端接相比,铬/铜的端接在MLCC的电气和机械性能方面具有良好的性能。

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