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首页> 外文期刊>Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe >Characterization of copper pastes for end termination application of base metal electrode MLCCs
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Characterization of copper pastes for end termination application of base metal electrode MLCCs

机译:用于贱金属电极MLCC末端终止应用的铜浆的表征

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摘要

The steep rise in the cost of palladium metal in the last decade has necessitated significant research and development efforts for using the base metal nickel electrodes in the manufacture of multilayer ceramic capacitors (MLCCs). Copper termination paste is hence a natural choice for end termination application of MLCCs using nickel electrodes, manufactured employing the base metal electrode (BME) process. The inert nitrogen atmosphere processing of the BME MLCCs has posed many challenges in the selection of organics (vehicles, binders, and additives), copper powders, and glasses for copper termination paste development. The effect of various organics and glasses on the drying as well as fired properties of different copper termination pastes is discussed. The effect of drying temperature and drying time on the fired properties of the copper termination, and the selection criteria for right composition of glass for copper termination paste are discussed. The properties of low and high firing temperature copper termination pastes are also presented.
机译:在过去的十年中,钯金属的价格急剧上升,因此需要进行大量的研究和开发工作,以在多层陶瓷电容器(MLCC)的制造中使用贱金属镍电极。因此,对于使用镍电极(采用贱金属电极(BME)工艺制造)的MLCC进行端接应用,铜端接膏是一种自然选择。 BME MLCC的惰性氮气氛处理在有机物(车辆,粘合剂和添加剂),铜粉和用于铜封端膏开发的玻璃的选择方面提出了许多挑战。讨论了各种有机物和玻璃对不同铜封端膏的干燥和烧成性能的影响。讨论了干燥温度和干燥时间对铜端子烧结性能的影响,以及用于铜端子浆料的玻璃正确组成的选择标准。还介绍了低烧和高烧温度的铜端接膏的性能。

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