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Process for the manufacturing of a DMOS-technology transistor providing for a single thermal process for the formation of source and body regions

机译:DMOS技术晶体管的制造工艺,提供用于形成源极区和主体区的单一热处理

摘要

Process for the manufacturing of a DMOS-technology transistor, providing for forming, over a semiconductor material layer (2) of a first conductivity type, an insulated gate electrode (5), introducing in said semiconductor material layer (2) a first dopant of a second conductivity type for forming at least one body region (6) of a second conductivity type extending under the insulated gate electrode, and introducing in said at least one body region (6) a second dopant of the first conductivity type for forming, inside said body region (6), at least one source region (9) of the first conductivity type, said body region (6) and said source region (9) defining, under the insulated gate electrode (5), a channel region for the DMOS transistor, wherein said first dopant is aluminum. After the introduction of said first dopant and said second dopant, a unique thermal diffusion process for simultaneously diffusing the first dopant and the second dopant.
机译:DMOS技术晶体管的制造方法,该方法用于在第一导电类型的半导体材料层(2)上形成绝缘栅电极(5),并在所述半导体材料层(2)中引入第一掺杂剂。第二导电类型,用于形成在绝缘栅电极下方延伸的第二导电类型的至少一个主体区域(6),并且在所述至少一个主体区域(6)中引入第一导电类型的第二掺杂剂,用于在内部形成所述主体区域(6),至少一个第一导电类型的源极区域(9),所述主体区域(6)和所述源极区域(9)在绝缘栅电极(5)下方限定用于所述栅极区域的沟道区域。 DMOS晶体管,其中所述第一掺杂剂是铝。在引入所述第一掺杂剂和所述第二掺杂剂之后,进行用于同时扩散所述第一掺杂剂和所述第二掺杂剂的独特的热扩散过程。

著录项

  • 公开/公告号EP0893821A1

    专利类型

  • 公开/公告日1999-01-27

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS S.R.L.;

    申请/专利号EP19970830371

  • 发明设计人 FRANCO GIOVANNI;

    申请日1997-07-21

  • 分类号H01L21/336;H01L21/225;

  • 国家 EP

  • 入库时间 2022-08-22 02:19:29

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