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Process for the manufacturing of a DMOS-technology transistor providing for a single thermal process for the formation of source and body regions

机译:DMOS技术晶体管的制造工艺,提供用于形成源极区和主体区的单一热处理

摘要

Process for the manufacturing of a DMOS-technology transistor, providing for forming, over a semiconductor material layer of a first conductivity type, an insulated gate electrode, introducing in said semiconductor material layer a first dopant of a second conductivity type for forming at least one body region of a second conductivity type extending under the insulated gate electrode, and introducing in said at least one body region a second dopant of the first conductivity type for forming, inside said body region, at least one source region of the first conductivity type, said body region and said source region defining, under the insulated gate electrode, a channel region for the DMOS transistor, wherein said first dopant is aluminum. After the introduction of said first dopant and said second dopant, a single thermal diffusion process for simultaneously diffusing the first dopant and the second dopant is provided.
机译:DMOS技术晶体管的制造方法,该方法用于在第一导电类型的半导体材料层上形成绝缘栅电极,在所述半导体材料层中引入第二导电类型的第一掺杂剂以形成至少一个第二导电类型的主体区域在绝缘栅电极下方延伸,并在所述至少一个主体区域中引入第一导电类型的第二掺杂剂,以在所述主体区域内形成至少一个第一导电类型的源极区域,所述主体区和所述源极区在绝缘栅电极下方限定了用于DMOS晶体管的沟道区,其中所述第一掺杂剂是铝。在引入所述第一掺杂剂和所述第二掺杂剂之后,提供用于同时扩散所述第一掺杂剂和所述第二掺杂剂的单个热扩散工艺。

著录项

  • 公开/公告号US6221719B1

    专利类型

  • 公开/公告日2001-04-24

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS S.R.L.;

    申请/专利号US19980119853

  • 发明设计人 GIOVANNI FRANCO;

    申请日1998-07-21

  • 分类号H01L213/36;H01L212/80;

  • 国家 US

  • 入库时间 2022-08-22 01:04:30

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