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NO-CLEAN SOLDERING FLUX AND METHOD USING THE SAME

机译:免清洗焊剂及其使用方法

摘要

No-clean scaling powder consists essentially of the free of one or more halide, the total no more than about flux of 5% weight % of water soluble activating agent, the flux and water of the amount of water soluble fluoridized surfactant no more than about 1% weight. The method of basic VOC-free scaling powders is particularly suitable for manufacture welding printed wiring component and pollutes with the smallest residual ion, makes to remove the assembly after welding to be unnecessary. Lack a large amount of VOC with washing effect Essential Environment after above-mentioned elimination welding and manufacture benefit.
机译:免洗水垢粉基本上由一种或多种卤化物组成,总助熔剂的总通量不超过5%(重量)的水溶性活化剂,水溶性氟表面活性剂的通量和水含量不超过约5%。 1%的重量。基本的不含VOC的水垢粉末的方法特别适合于制造焊接印刷线路组件,并且污染最小的残留离子,从而使焊接后无需拆卸组件。经过上述消除焊接后,缺乏大量具有洗涤效果的VOC具有“基本环境”的作用和制造优势。

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