Printed circuit boards for chip on board (COB) packages and chip on board packages using the same

摘要

The present invention relates to a printed circuit board for a chip on board (COB) package and a chip on board (COB) package using the printed circuit board, and the printed circuit board strip to be used for manufacturing the chip on board package is handled in a laminated form When the printed circuit board located on the upper side moves for the progress of the manufacturing process in a state in which the upper surface of the printed circuit board and the lower surface of the adjacent printed circuit board are in contact with each other, there arises a problem that the surface of the facing upper printed circuit board is scratched In order to overcome the problem that the plating layer of the substrate bonding pad integrally formed with the circuit pattern is scratched or peeled off and the wire bonding property between the plating layer and the bonding wire is inferior, the substrate bonding pad is pressed against the upper surface of the circuit pattern by coining On-board (COB) package and a chip-on-board (COB) package using the printed circuit board.