A vertical mounting type semiconductor chip package having a printed circuit board and a heat sink, and a package module

摘要

The present invention relates to a vertically mounted semiconductor chip package including a printed circuit board and a heat sink, and a package module including the same. Since the heat generated in the chip is discharged through the sealing resin or the printed circuit board in the conventional vertical mounting type package, the heat radiation effect is insufficient. In order to solve this problem, the chip is directly attached to the metal heat sink, A vertical mounting type package is provided in which a metal heat sink is brought into contact with a metal layer using a printed circuit board containing a metal layer, thereby achieving a better heat radiation effect. There is also a case where such a vertical mounting type package is vertically mounted on a circuit board and a heat dissipating device is attached to each heat dissipating plate, thereby doubling the heat dissipating effect. By improving the heat radiation effect as described above, it is possible to solve the problem of heat emission in a Rambus DRAM package, particularly a Rambus DRAM package with a capacity of 64M or more, which is floating as a next generation memory device.