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Power semiconductor device with improved avalanche characteristics and method of manufacturing the same

机译:具有改善的雪崩特性的功率半导体器件及其制造方法

摘要

A power semiconductor device having improved avalanche characteristics and a method of manufacturing the same are disclosed. The power semiconductor device includes a first conductive type drain region formed in a first conductive type semiconductor substrate, a second conductive type base region formed in the drain region, a first conductive type source region formed in the base region, A gate electrode formed on a semiconductor substrate via a gate insulating film; and a second conductivity type impurity which is formed in the base region and is composed of a first region surrounding the bottom surface of the source region and a second region formed to be self- .
机译:公开了具有改善的雪崩特性的功率半导体器件及其制造方法。功率半导体器件包括:形成在第一导电类型的半导体衬底中的第一导电类型的漏极区域;形成在漏极区域中的第二导电类型的基极区域;形成在基极区域中的第一导电类型的源极区域;以及形成在栅极上的栅电极。半导体衬底经由栅绝缘膜;第二导电类型杂质形成在基极区域中,并且由围绕源极区域的底表面的第一区域和形成为自掺杂的第二区域组成。

著录项

  • 公开/公告号KR19990069530A

    专利类型

  • 公开/公告日1999-09-06

    原文格式PDF

  • 申请/专利权人 김덕중;

    申请/专利号KR19980003835

  • 发明设计人 최영철;

    申请日1998-02-10

  • 分类号H01L29/739;

  • 国家 KR

  • 入库时间 2022-08-22 02:16:45

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