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Dry etching devices for manufacturing semiconductor devices with shadow rings

机译:用于制造具有阴影环的半导体器件的干蚀刻器件

摘要

A dry etching apparatus for manufacturing a semiconductor device having a shadow ring is disclosed. The dry etching apparatus according to the present invention includes a shadow ring installed around a pedestal supporting a wafer in an etching chamber to prevent reactive ions from escaping from inside the etching chamber into the pumping line. The shadow ring is detachably attached to the shadow ring on a first portion of the shadow ring and a shadow ring body comprising a first portion formed at a relatively thin thickness on the inner circumferential side and a second portion formed at a relatively thick thickness on the outer circumferential side. And a collar such that the height of the top surface is equal to the height of the top surface of the pedestal when coupled and mounted in the etching chamber in engagement with the shadow ring.
机译:公开了一种用于制造具有阴影环的半导体器件的干蚀刻设备。根据本发明的干法刻蚀设备包括围绕安装在刻蚀室内的晶片的基座周围的阴影环,以防止反应离子从刻蚀室内部逸出到泵送管线中。遮蔽环在遮蔽环的第一部分上可拆卸地附接到遮蔽环,并且遮蔽环主体包括在内周侧上以相对较薄的厚度形成的第一部分和在遮蔽环上以相对较厚的厚度形成的第二部分。外周侧。以及一个套环,使得当其耦合并安装在与影环接合的蚀刻室中时,顶表面的高度等于基座的顶表面的高度。

著录项

  • 公开/公告号KR19990075169A

    专利类型

  • 公开/公告日1999-10-15

    原文格式PDF

  • 申请/专利权人 윤종용;

    申请/专利号KR19980009228

  • 发明设计人 김봉선;박수관;

    申请日1998-03-18

  • 分类号H01L21/306;

  • 国家 KR

  • 入库时间 2022-08-22 02:16:38

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