首页> 外国专利> DEVICE FOR FIXING MAGAZINE OF TRIMMING/ FORMING FOR SEMICONDUCTOR MANUFACTURING

DEVICE FOR FIXING MAGAZINE OF TRIMMING/ FORMING FOR SEMICONDUCTOR MANUFACTURING

机译:用于半导体制造的修边/成形杂志固定装置

摘要

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magazine fixing device for trim / forming equipment for manufacturing a semiconductor package. The present invention relates to a magazine fixing device for supplying molded leadframe materials without interruption. A cylindrical rotating body rotated to the upper and lower parts, and upper and lower supporting members are installed on the rotating body, and fixing blocks are respectively installed at positions corresponding to the magazine widths so as to fix a plurality of magazines. On the inner side of the fixing block, the ball is insulated by the spring, and the ball is fixed to the side of the magazine so that when the supply of leadframe material loaded in the magazine is completed, the rotating body is rotated by an angle so that the new magazine is positioned in the supply part. Improved productivity and work efficiency by ensuring continuous supply of preformed leadframe materials Magazine fixing device for trim / forming equipment for semiconductor package manufacturing.
机译:盒固定装置技术领域本发明涉及一种用于制造半导体封装的修整/成型设备的盒固定装置。本发明涉及一种用于不间断地供应模制引线框架材料的盒固定装置。旋转至上部和下部的圆柱形旋转体以及上部和下部支撑构件安装在旋转体上,并且固定块分别安装在对应于弹匣宽度的位置处,以固定多个弹匣。在固定块的内侧,滚珠通过弹簧绝缘,并且滚珠固定在料盒的侧面,这样,当完成装载在料盒中的引线框架材料的供应时,旋转体就会旋转角度,以便将新杂志盒定位在供应部件中。通过确保连续供应预制的引线框架材料来提高生产率和工作效率,用于半导体封装制造的修整/成形设备的弹匣固定装置。

著录项

  • 公开/公告号KR0166561B1

    专利类型

  • 公开/公告日1999-01-15

    原文格式PDF

  • 申请/专利权人 ANAM SEMICONDUCTOR LTD.;

    申请/专利号KR19950036949

  • 发明设计人 박범희;

    申请日1995-10-25

  • 分类号H01L23/495;

  • 国家 KR

  • 入库时间 2022-08-22 02:16:26

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