A manufacturing method for manufacturing a laminated semiconductor device, a determination method for determining the size of a region to be trimmed, a determination method for determining a position for forming an electrode, a manufacturing system for manufacturing a laminated semiconductor device, a trimming device, and a lamination device.

摘要

PROBLEM TO BE SOLVED: To remove voids of a laminated semiconductor device at an inexpensive cost. A manufacturing method for manufacturing a laminated semiconductor device by laminating a first substrate and a second substrate, wherein a laminating step of laminating a first substrate and a second substrate and a laminating step are performed. Later, it comprises a trimming step of trimming at least one peripheral edge of the first substrate and the second substrate based on the position of the air bubbles between the first substrate and the second substrate. The size of the region to be trimmed in the trimming step may be a size from which at least a part of the bubbles is removed. [Selection diagram] Fig. 4