Wafer planarization involves developing for almost complete photoresist layer removal above highest peaks

摘要

A silicon wafer is planarized by uniformly exposing an applied photoresist layer (4), developing to remove almost the entire photoresist layer above the highest wafer surface peaks (5) and then plasma-chemical back-etching. Preferred Feature: The photoresist viscosity is such that a spin-on or other coating process produces a layer thickness (d) of two to four times the maximum height difference (h) of the wafer surface.