SUBSTRATE PLANARIZING METHOD CAPABLE OF FORMING A PLANARIZED SUBSTRATE BY DEVELOPING A PHOTORESIST LAYER

摘要

PURPOSE: A substrate planarizing method is provided to prevent a spot in the following process by planarizing a substrate through a rear exposure process.;CONSTITUTION: A top metal layer and a bottom metal layer are formed on the upper side of a substrate(100). A bottom layer(110p) and a top layer(120p) are formed on the substrate by etching the top metal layer and the bottom metal layer. A photoresist layer(PR) covers the substrate, the bottom layer, and the top layer. The photoresist layer is exposed by irradiating the lower side of the substrate. The exposed top layer and bottom layer are successively removed by using etchants.;COPYRIGHT KIPO 2012