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Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes
Structure and fabrication method for interconnecting light emitting diodes with metallization extending through vias in a polymer film overlying the light emitting diodes
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机译:用于将发光二极管与覆盖在覆盖发光二极管的聚合物膜中的通孔延伸的金属化互连的结构和制造方法
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摘要
A light emitting diode (LED) interconnection package includes an LED situated on a substantially transparent substrate, the LED having a contact surface with contact pads and having side surfaces; a polymer film overlying the contact surface and having via openings; a substantially transparent support piece surrounding the side surfaces of the LED and the substrate; and metallization overlying the polymer film and extending through the via openings for interconnecting the contact pads.
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