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Single transistor ferroelectric memory cell with asymmetrical ferroelectric polarization and method of making the same

机译:具有不对称铁电极化的单晶体管铁电存储单元及其制造方法

摘要

A method of forming a semiconductor structure having a ferroelectric memory (FEM) gate unit on a silicon substrate includes implanting doping impurities of a first type into the substrate to form a conductive channel of a first type, implanting doping impurities of a second type in the conductive channel of the first type to form a conductive channel well of a second type, implanting doping impurities of a third type in the conductive channel well of the second type to form a conductive channel of a third type for use as a gate junction region, implanting doping impurities of a fourth type in the conductive channel sub-well of the third type on either side of the gate junction region to form plural conductive channels of a fourth type for use as a source junction region and a drain junction region; and depositing an FEM gate unit over the gate junction region. A ferroelectric memory cell includes a silicon substrate of a first conductive type, a well structure of a second conductive type formed in the substrate, a structure of a third conductive type formed in the well structure, for use as a gate junction region. A source junction region and a drain junction region are located in the sub-well on either side of the gate junction region, doped to form conductive channels of a fourth type. A FEM gate unit overlays the conductive channel of the third type. An insulating layer overlays the junction regions, the FEM gate unit and the substrate. Suitable electrodes are connected to the various active regions in the memory cell.
机译:一种在硅衬底上形成具有铁电存储器(FEM)栅极单元的半导体结构的方法,该方法包括将第一类型的掺杂杂质注入到衬底中以形成第一类型的导电沟道,将第二类型的掺杂杂质注入到硅衬底中。第一类型的导电沟道以形成第二类型的导电沟道阱,将第三类型的掺杂杂质注入第二类型的导电沟道阱中以形成第三类型的导电沟道,以用作栅极结区,在栅极结区域的任一侧上的第三类型的导电沟道子阱中注入第四类型的掺杂杂质,以形成多个第四类型的导电沟道,以用作源极结区域和漏极结区域;在栅极结区上方沉积FEM栅极单元。铁电存储单元包括用作栅极结区的第一导电类型的硅基板,形成在基板中的第二导电类型的阱结构,形成在阱结构中的第三导电类型的结构。源极结区和漏极结区位于栅极结区两侧的子阱中,被掺杂以形成第四类型的导电沟道。 FEM门单元覆盖第三类型的导电沟道。绝缘层覆盖结区,FEM栅极单元和衬底。合适的电极连接到存储单元中的各个有源区。

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