The conductive coating material, and use this the etched circuit substrate and the electromagnetic wave reverse clipping attaching flexible printed circuit organizer

摘要

PURPOSE:To obtain a conductive coating material excellent in adhesion to the surfaces of both of oxidized and non-oxidized copper foils as well as in electric conductivity by compounding a metallic copper powder, a resol phenol resin, a chelating agent, an adhesion improver, and an electric conductivity improver in a specified ratio, CONSTITUTION:100 pts.wt. metallic copper powder, 5-30 pts.wt. resol phenol resin. 0.5-4 pts.wt. chelating agent, 0.1-5 pts.wt. adhesion improver, and 0.5-7 pts.wt. electric conductivity improver are compounded to give a conductive coating material, which is excellent in adhesion to the surfaces of both of oxidized and non-oxidized copper foils as well as in electric conductivity and esp. resistance to soldering heat and hence is suitably used in jumper wiring, electromagnetic shielding, etc., in a printed circuit board.