DIE FOR PUNCHING LEAD FRAME, AND LEAD CUTTING METHOD

摘要

PROBLEM TO BE SOLVED: To simplify the lead cutting process, and to eliminate the work for removing chips. ;SOLUTION: In this lead cutting method, the cutting and bending can be continuously effected using one set of die comprising a cutting die 3 in the reverse direction, a bending die 4, and a cutting punch 5, and two sets of dies to be used in a conventional lead cutting and separating process can be reduced to one set. In addition, the time for the lead cutting and separating process is shortened approximately by half, no chips are generated since no lead cut-off process is present, and the chip removing work in the post-process can be eliminated.;COPYRIGHT: (C)1999,JPO