Target containment feature null of thin film formation

摘要

A device for forming thin film having a plurality of low-pressure chambers, an evacuating means connected thereto, and a gas feeding means. The device further includes at least one first low-pressure chamber with means for irradiating a wafer with ions of small kinetic energy while avoiding any film deposition on it, at least one second low-pressure chamber for forming a thin film on the wafer surface by sputtering, and a mechanism for transporting the wafer between the first and the second low-pressure chambers while keeping it under low pressure.