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The sputtering target material for thin film formation which features that it consists of the metallic materials of 2 original alloys which the sputtering target material for thin film formation,
The sputtering target material for thin film formation which features that it consists of the metallic materials of 2 original alloys which the sputtering target material for thin film formation,
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机译:薄膜形成用溅射靶材的特征在于,其由2种原始合金的金属材料构成,该薄膜形成用溅射靶材具有:
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摘要
PPROBLEM TO BE SOLVED: To provide a sputtering target material for forming a thin film, which improves manufacturing easiness in a step of manufacturing an alloy, and stability and simplicity in a sputtering step when using it for a sputtering target. PSOLUTION: The sputtering target material for forming the thin film is made of a metallic material including Ag as a main component and 0.1-3.0 wt.% Mo. The use of such a sputtering target material for forming the thin film solves the problems in a prior art, and realizes a technology having various superior characteristics as the components of the various electronic components, electronic devices, optoelectronic components and optical recording media, while utilizing the advantages of Ag. PCOPYRIGHT: (C)2004,JPO&NCIPI
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