METHOD FOR SEALING SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT CHIP DEVICE, AND SEMICONDUCTOR INTEGRATED CIRCUIT CARD

摘要

PROBLEM TO BE SOLVED: To obtain a method for sealing a semiconductor integrated circuit chip which can obtain a semiconductor integrated circuit chip device which has a considerably high strength and less variance in sealing shape and sealing thickness. SOLUTION: A semiconductor integrated circuit chip(IC chip) CP is adhered onto a board FB where a circuit pattern is formed, and an electrode of the IC chip CP is connected to the circuit pattern, and a prescribed amount of sealing resin SP' is applied on a first reinforcing metallic plate MP1, and the board FB to which the IC chip CP is adhered is placed on the first reinforcing metallic plate MP1 with the coating sealing resin SP' between them, and a prescribed amount of the sealing resin SP' is applied onto the IC chip CP, and a second reinforcing metallic plate MP2 is arranged on the coating sealing resin SP'. The sealing resin SP' is pressurized through first and second reinforcing metallic plates MP1 and MP2 and is caused to flow to the peripheral surface of the IC chip CP, and the sealing resin SP' which has flown to the peripheral surface of the IC chip CP is hardened.