SEALING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT CHIP, SEMICONDUCTOR INTEGRATED CIRCUIT CHIP DEVICE AND SEMICONDUCTOR INTEGRATED CIRCUIT CARD

摘要

PROBLEM TO BE SOLVED: To improve the adhesion strength of a reinforcing plate and a sealing resin in a method for sealing a semiconductor integrated circuit chip by the resin by arranging the reinforcing plate through the resin for sealing on each of upper and lower sides of the semiconductor integrated circuit chip packaged on a film substrate. ;SOLUTION: The film substrate, on which a circuit pattern is formed and the semiconductor integrated circuit chip is packaged, is coated with the prescribed quantity of the resin for sealing on the first reinforcing plate arranged on the side of lower face, the semiconductor integrated circuit chip is coated with the prescribed quantity of the resin for sealing as well, the second reinforcing plate is placed on the side of upper face, and the resin for sealing is made flow into the peripheral surface of the semiconductor integrated circuit chip by pressing the first and second reinforcing plates from the upper and lower sides. In such a sealing method, the face of each of first and second reinforcing plates in contact with the sealing resin is worked into rough face at least and the adhesion strength of the reinforcing plate for protecting the semiconductor integrated circuit chip and the sealing resin is remarkably improved.;COPYRIGHT: (C)2003,JPO