首页> 外国专利> AlTi SERIES ALLOY SPUTTERING TARGET, WEAR RESISTANT AlTi SERIES ALLOY HARD FILM AND FORMATION OF THE FILM

AlTi SERIES ALLOY SPUTTERING TARGET, WEAR RESISTANT AlTi SERIES ALLOY HARD FILM AND FORMATION OF THE FILM

机译:AlTi系列合金的溅射靶材,耐磨AlTi系列合金的硬膜及其成膜

摘要

PROBLEM TO BE SOLVED: To improve the hardness, oxidation resistance, adhesion with a base material or the like of a film formed on a cutting tool, a sliding member, a metal working tool or the like, to provide it with balanced characteristics, to execute stable film formation and to improve the service lives of the tools by allowing a sputtering target to have a specified compsn. ;SOLUTION: This AlTi series alloy sputtering target is the one having a compsn. of AlxTi1-x-y-zMyRz (where M denotes one or more kinds of elements selected from W and Mo, R denotes one or more kinds of rare earth elements selected from Y, Ce, La, misch metals or the like, and 0.05≤x≤0.7, 0.02≤y≤0.25, and 0.0005≤z≤0.05 are satisfied), the M moreover contains one or more kinds of elements selected from Si and Cr. The sputtering target can be produced by a melting method such as vacuum arc melting and plasma melting, and there is the need of melting in a vacuum or in an inert atmosphere. Moreover, it may also be produced by powder metallurgy in such a manner that Ti, Si and Al powders of prescribed particle sizes are mixed in prescribed ratio.;COPYRIGHT: (C)2000,JPO
机译:解决的问题:为了提高在切削工具,滑动构件,金属加工工具等上形成的膜的硬度,抗氧化性,与基材等的粘附性,以使其具有平衡的特性,通过允许溅射靶材具有规定的成分来执行稳定的成膜并改善工具的使用寿命。 ;解决方案:该AlTi系列合金溅射靶是具有复合材料的靶。 (其中M表示选自W和Mo的一种或多种元素,R表示选自Y,Ce,La,稀土金属等的一种或多种稀土元素,且0.05≤x满足≤0.7、0.02≤y≤0.25和0.0005≤z≤0.05),并且M还包含选自Si和Cr中的一种或多种元素。可以通过诸如真空电弧熔化和等离子体熔化之类的熔化方法来制造溅射靶,并且需要在真空或惰性气氛中熔化。此外,也可以通过粉末冶金法以规定比例混合规定粒径的Ti,Si和Al粉末的方法生产。COPYRIGHT:(C)2000,JPO

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号