OPTICAL SEMICONDUCTOR ELEMENT, PACKAGING STRUCTURE THEREOF AND PACKAGING STRUCTURE OF GROUP THEREOF

摘要

PROBLEM TO BE SOLVED: To make it possible to realize a reduction in the thickness of an optical semiconductor element in a form that the optical semiconductor element is mounted on a circuit board. SOLUTION: This element A is an optical semiconductor element of a structure, wherein the element A has a form that a semiconductor chip 3 having a light-emitting function or a light-receiving function and first and second lead terminals 1 and 2 used as electrodes on the chip 3 are encapsulated in a resin package 4. The electrical connection of these terminals 1 and 2 with a circuit board or the like is made possible by extending respective outer leads 11 and 21 on the terminals 1 and 2 outside of the package 4. Here, the respective outer leads 11 and 21 on the terminals 1 and 2 are formed in an attitude extending the leads 11 and 21 almost horizontally from both side surfaces 42 and 43 opposing to each other of the package 4 toward the outward and in a straight line form.